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Figure 3 from Under Bump Metallurgy (UBM)-a technology review for flip chip packaging
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Effects of Under Bump Metallurgy (UBM) Materials on the Corrosion of Electroless Nickel Films
Pb-Free Solders for Flip-Chip Interconnections
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Figure 7 from Under Bump Metallurgy (UBM)-a technology review for flip chip packaging
Effects of Under Bump Metallurgy (UBM) Materials on the Corrosion of Electroless Nickel Films
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The surface characteristics of under bump metallurgy (UBM) in electroless nickel immersion gold (ENIG) deposition - ScienceDirect
Effects of Under Bump Metallurgy (UBM) Materials on the Corrosion of Electroless Nickel Films